Hong Kong Stock Code:00567

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Huafeng Microline(huizhou) Circuits Ltd.

Industrial

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ItemStandardAdvancedRemark
Max Layer Count1224
ThicknessMin0.2mm0.2mm
Max2.4mm3.2mm
Max SizeDelivery Unit510*610mm510*610mm
Production Panel 520*622mm520*622mm
Copper thicknessInner1 - 3 oz6 oz
Outer1/3 - 3 oz6 oz
Inner layerMin width0.076mm0.050mm
Min space0.076mm0.076mm
Outer layerMin width0.076mm0.076mm
Min space0.076mm0.076mm
Min mechanical Dill Size0.25mm0.15mm
Min Laser Drill Size0.10mm0.10mm
Laser Via PadInner 0.275mm0.25mm
Outer0.275mm0.25mm
Asoect RatioLBMV1:011:01
MVTH8:0110:010.3mm drill bit size
Dieletric ThicknessInner Core0.05mm0.05mm
Prepreg0.05mm0.05mm
HDI 1+N+13+N+3with   copper filling
2+N+2
Max Aspect Ratio Plughing by resin1:071:08
Solder maskGap0.05mm0.05mm
Bridge0.076mm0.635mm
Surface finishing1. LF HAL/ HAL

2. ENIG 

3. OSP 

4. ENIG+PRE-FLUX

5. Immersion Silver

6. Immersion Tin 

7. Hard gold finger 

8. Carbon ink print

Material1.  Normal TgHi frequencyHitachi Chemical; ShengYi; Rogers
2. High Tg
3. Lead Free
4. Halogen Free